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Flexible & Stretchable Electronics Prototyping and Testing


Term:

Fall

Department:

2: Mechanical Engineering

Faculty Supervisor:

Kamal Youcef-Toumi

Faculty email:

youcef@mit.edu

Apply by:

9/25

Contact:

Ali Alshehri: ashehri@mit.edu

Project Description

A UROP candidate will help in design and assembly of flexible stretchable substrates for sensing applications. The goal is to build flexible films and possibly encapsulated in a solid or soft hosting matrix. Candidate is expected to learn and use new electronic printing processes such as 3D printing, ink jet printing, spin coating or photo-lithography. Good knowledge will be gained on flexible circuits design, assembly, fabrication and radio frequency network analyzers and S-parameters testing. This role involves regular communication meetings with project members and principle investigator on progress and guidance. Research team will be composed of one postdoc, a PhD student and a technical representative from the sponsored company of the project.

Pre-requisites

Basic Solidworks software tools